Every year, Predictive Engineering attends an LS-DYNA Conference, this year it was in Dearborn, MI and next year, it’ll be in Koblenz, Germany. The technical sessions were the usual mix of sleepers with just enough talks that set off mental sparks to keep you motivated. There were three stand-out talks for me:
(i) Modeling & Simulation Challenges at the Interface between Man and Machine: Medical Devices by Dr. M. Palmer
(ii) Modeling of a Cross-Ply Thermoplastic for Thermoforming of Composite Sheets in LS-DYNA by K. White and
(iii) An Enhance Assumed Strain (EAS) Solid Element for Nonlinear Implicit Analysis by T. Borrvall.
The first paper was by Medtronic and the background gossip is that they are moving away from other commercial solvers to focus on just LS-DYNA due to its multi-physics capabilities and especially its strong nonlinear implicit performance. The second paper was a stunner and showed how thermoplastics can easily reach their glass transition temperature under moderate strain rates. In essence, whenever composites are simulated under dynamic environments, one should consider temperature effects on the resin and how it will lower its elasticity. The third paper was just plain fun mechanics and how LS-DYNA is continually expanding its capabilities in the implicit arena.